1.Product’s type: single-sided/double-sided and multi-layer PCB. Gold-plated 、Immersion gold-plated, HAL finish , Flux., Carbon -bridge, Entek, Nickel plating.
2.Base material: FR4 、CEM-1、CEM-3、FR1、FR2
3.Base material THICKNESS: 0.4-2.4mm.
4.Copper foil thickness:18um(H/HOZ) 、35um(1/1OZ) 、70um(2/2OZ), 5OZ
5.Maximum-product board: 500*700mm.
6.Minimum drilled hole size: 0.2mm.
7.Minimum line/spacing: Gold-plated:0.06mm
HAL:0.1mm.Flash gold plating: ≥0.05um |
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